APPARATUS FOR CLEANING WIPER OF CHEMICAL MECHANICAL POLISHING FACILITIES

摘要

PURPOSE: An apparatus for cleaning a wiper of chemical mechanical polishing(CMP) facilities is provided to reduce a manufacturing cost, by protecting a wafer from a particle remaining in a wiper sponge, so that the wiper sponge can be used longer. CONSTITUTION: An apparatus(100) for cleaning a wiper(102) of chemical mechanical polishing(CMP) facilities comprises a supplying element(112) for supplying inert gas to a cleaning bath(106), in which the wiper can be more effectively cleaned with cleaning solution(108) and inert gas bubble(110) by supplying the cleaning solution and the inert gas to the cleaning bath to generate the inert gas bubble in the cleaning solution.