ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an electronic component without shortcircuit defect. SOLUTION: A bottomed package 1 with an opening part in an upper part, an elastic surface wave element 6 stored inside the package 1 and a lid 4 which seals an opening part of the package 1 by a solder layer 5 are provided. Since the package 1 has at least one recessed part 2 which is continuous with an outer circumferential part side surface from an upper edge face, excess solder is made to flow in the recessed part 2 when an opening part is sealed by the lid 4.