RESIN SEALED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can thin a resin mold by removing a die pad and can facilitate the register at resin molding. SOLUTION: This semiconductor device possesses a rectangular semiconductor chip 9 having a plurality of electrode pads 10 at the topside, a plurality of inner leads 3 arranged around this semiconductor chip 9, a wire 7 to connect an electrode pad 10 with each inner lead 3, and a resin mold to seal the semiconductor chip 9, the inner lead 3, and the wire 7. In this case, this is provided with chip retaining bars 6 for fixing and retaining this semiconductor chip 9 in specified positions at molding, at a pair at least of diagonal corners of the semiconductor chip 9.