| 摘要 |
PROBLEM TO BE SOLVED: To provide a wet etching system in which yield of semiconductor devices being fabricated on a wafer can be increased by preventing adhesion of dust to the wafer. SOLUTION: A wet etching system comprises a processing tank 2 in which a plurality of wafers 1 and etching liquid are placed, and a jet flow pipe 7 having a plurality of holes in the side face disposed on the bottom of the processing tank 2 rotatably about the central axis. The wet etching system further comprises a motor, a belt for transmitting the rotation of the motor to the jet flow pipe 7, a motor driver for controlling the rotation of the motor, an overflow tank 3 for storing etching liquid flowing over the processing tank 2, a pump 5 for feeding the stored etching liquid to the jet flow pipe 7, and a filter 6 disposed between the overflow tank 3 and the processing tank 2 and removing dust in the etching liquid stored in the overflow tank 3.
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