MANUFACTURE OF SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To enable semiconductor elements to be easily separated from an adhesive sheet, after a semiconductor wafer is cleaved. SOLUTION: A first process where a semiconductor wafer is pasted on the surface of an adhesive sheet 2 and then cleaved into semiconductor elements 1a, a second process where the adhesive sheet 2 is stretched to separate the split semiconductor elements 1a from each other after the wafer is cleaved, a third process, where the rear surface of the adhesive sheet 2 is irradiated with ultraviolet rays to cause the adhesive sheet 2 to lower in adhesive power, and a fourth process where the semiconductor elements 1a are dismounted from the adhesive sheet 2 by the use of the a vacuum suction jig 4 are provided.