| 摘要 |
PROBLEM TO BE SOLVED: To provide a die collet not damaging a thin and long chip. SOLUTION: In a die collet for chucking and holding a rectangular thin and long chip contacted at the end face to receiving faces 31, 32 by evacuating it through a suction hole 34, the receiving face 32 for contacting the narrow side end face of the chip is defined by approximately a V-shaped notch 33, piercing the lower end of the die collet in the width direction. Thus the narrow side end face of the chip contacts the receiving face 32 over the entire width, this avoiding concentrating the pressing load on the end face of the chip during bonding and hence preventing the damage to the chip. |
