发明名称 POLISHING PAD AND POLISHING MACHINE
摘要 PROBLEM TO BE SOLVED: To prevent a polishing pad from deteriorating in stability of polishing characteristic by a method wherein the polishing pad is equipped with a polishing layer of syntactic foam that contains conductive corpuscles. SOLUTION: A polishing layer of syntactic foam can be used together with a cushioning layer to serve as one layer out of a two-layered structure, where the polishing layer of syntactic foam is provided in the polishing platen of a polishing machine through the intermediary of the cushioning layer that is used for following the undulations of a semiconductor wafer when a semiconductor wafer is polished. Syntactic foam is formed through a manner where hollow corpuscles of glass, plastic material or the like are dispersed in a plastic matrix. Various kinds of material can be used as a plastic matrix, for instance, thermosetting resin such as an epoxy resin, an unsaturated polyester, a phenolic resin, a polyurethane, silicone, addition polymer such as a polyethylene, a polystyrene, a polyvinyl chloride, and thermoplastic resin such as a polyester represented by a polyethylene terephthalate, a polyamide represented by nylon 6, nylon 66 can be used as a plastic matrix.
申请公布号 JP2000216121(A) 申请公布日期 2000.08.04
申请号 JP19990012162 申请日期 1999.01.20
申请人 TORAY IND INC 发明人 OKA TETSUO;JIYOU KUNITAKA
分类号 B24B37/20;B24B37/24;B24D3/00;B24D3/02;B24D3/28;B24D3/34;H01L21/304 主分类号 B24B37/20
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