| 摘要 |
PROBLEM TO BE SOLVED: To obtain a plating layer having excellent adhesion property and high quality and showing more similar appearance to metals by adding conductivity to the surface of an urethane resin base body and then electroplating the surface. SOLUTION: After the surface of an urethane resin base body 1 is softened with acetone or the like as pretreatment, the surface is chemically polished due to roughening in a potassium permanganate/sodium hydroxide mixture soln. at about 60 to 70 deg.C for about 5 to 15 min, and then the surface is neutralized. Then the surface is subjected to electroless copper plating at about 20 to 25 deg.C for about 5 to 20 min to form a chemical copper plating layer 2 of about 0.2 to 0.5μm thickness to impart conductivity. Further, a copper electroplating layer 3 of about 30 to 50μm thickness is formed to increase the thickness. Then a nickel electroplating layer 4 of about 5 to 30μm thickness is formed as a base plating for the uppermost plating, and a chromium plating layer 5 of about 0.1 to 0.3μm thickness is formed by flash treatment as the finish uppermost plating layer.
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