发明名称 MELAMINE RESIN MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a melamine resin molding material having flexibility, good electrical properties such as tracking resistance and color fastness. SOLUTION: The objective molding material is produced by compounding 100 pts.wt. of a melamine resin with 1-40 pts.wt. of an epoxy resin. The epoxy resin preferably has a structure free from benzene ring.
申请公布号 JP2000212389(A) 申请公布日期 2000.08.02
申请号 JP19990012701 申请日期 1999.01.21
申请人 SUMITOMO BAKELITE CO LTD 发明人 KAWAMURA SATORU
分类号 C08L61/28;C08G59/22;C08G59/50;(IPC1-7):C08L61/28 主分类号 C08L61/28
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