| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor sealing use, having excellent fluidity and high reliability and suitable for the sealing of semiconductor device by compounding an epoxy resin with a specific phenolic resin and an inorganic filler having a specific particle size distribution. SOLUTION: The objective epoxy resin composition for semiconductor sealing use is produced by compounding an epoxy resin with a phenolic resin expressed by formula (R1 is H or a 1-10C alkyl; R2 and R3 are each H, a 1-10C alkyl or a halogen; (n) is an integer of >=0) and containing a resin of n=1 in an amount of >=50 wt.% at a compounding ratio of 0.5-2.0 hydroxyl equivalent of the phenolic resin based on 1 equivalent of the epoxy group of the epoxy resin and mixing the obtained composition with >=75 wt.%, preferably 80-91 wt.% (based on the total composition) of an inorganic filler such as fused spherical silica powder consisting of a mixture of 50-92 wt.% of a fraction (x) having an average particle diameter of 20-60μm, 5-40 wt.% of a fraction (y) selected from the fraction (x) and satisfying the formula 0.1α<=y<=0.2αwhereinαis average particle diameter and 3-15 wt.% of a fraction (z) satisfying the formula 0.01α<=z<=0.1α.
|
