发明名称 |
Method for depositing solder paste on a pad |
摘要 |
Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
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申请公布号 |
US6094832(A) |
申请公布日期 |
2000.08.01 |
申请号 |
US19990270695 |
申请日期 |
1999.03.17 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
REGNER, RICHARD;BUTLER, SCOTT;BLUE, CAREY |
分类号 |
H05K3/34;(IPC1-7):G01B5/14;F23J3/00 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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