发明名称 Method for forming a refractory metal silicide layer
摘要 A method for forming a refractory metal silicide layer on a silicon surface in which a first layer of a refractory metal is formed on the silicon surface. A second layer extends over the first layer and is made of a nitrogen containing refractory metal. The silicon surface and the first and second layers are subjected to a heat treatment in an argon gas atmosphere to form a refractory metal silicide layer on an interface between the silicon surface and the first layer.
申请公布号 US6096638(A) 申请公布日期 2000.08.01
申请号 US19960742595 申请日期 1996.10.28
申请人 NEC CORPORATION 发明人 MATSUBARA, YOSHIHISA
分类号 H01L21/28;H01L21/285;H01L21/336;(IPC1-7):H01L21/476;H01L21/44 主分类号 H01L21/28
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