| 摘要 |
PROBLEM TO BE SOLVED: To reduce step parts in an integrated circuit, to sufficiently cover the step parts in the integrated circuit and to provide the integrated circuit having a practically flat surface without performing chemical machine working. SOLUTION: In this production method of the integrated circuit, the step parts in the integrated circuit are reduced by providing a step for sticking a first conductive material layer 14 on a first inductive material layer 12 and a step for forming a first conductive pattern 15 by patterning the first conductive material layer 14. Next, a second inductive layer 16 is stuck on a part exposing the first conductive pattern 15 and the first inductive material layer 12. A flattening material layer 20 is applied and hardened on a second inductive material layer 14, so that the flattening material layer 20 can form a practically flat upper surface 22. Until only the previously selected quantity of materials is left on the first conductive pattern 15, a portion 28 of the flattening material layer 20 and the second inductive material layer 16 is removed in such a way that the practically flat upper surface is maintained. |
