| 摘要 |
PROBLEM TO BE SOLVED: To improve the throughput of test, enable tests at an accurate temperature to be performed, and realize a miniaturization, simplification and cost reduction of a test device. SOLUTION: Two tray accommodating parts 212, 214, an elevator 206, a transfer arm 208 and a set plate 210 are installed in an accommodating part 200. A socket 50 for test and a board pusher 76 are installed in a measuring part 102. A memory module 10 as an object to be tested is mounted on a tray 20 for test, carried in the measuring part 102 and tested in the mounted state.
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