| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which is capable of ensuring that an outer connection pad is bonded to a conductor pattern keeping high bonding strength. SOLUTION: Resist is applied onto the surface of a conductor pattern 3, exposed to light, developed, and thermally cured into a resist film 4, an opening 5 is provided to the resist film 4 for the formation of a printed wiring board 1, where the opening 5 provided to the resist film 4 has a structure where a lower opening 5a is larger than an upper opening 5b in size by 5 to 50μm. By this setup, a plating film 6 is formed under the resist film 4 just as it strikes its roots, so that the plating film 6 gets high in adhesion to the conductor pattern 3. At the same time, the resist film 4 is also firmly joined to the plating film 6.
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