A polyamic acid ester which has a structure comprising repeating units of specific amic acid esters and having repeating units each comprising a tetravalent benzene group and repeating units each comprising a tetravalent diphenyl ether group in a specific ratio and which, when applied on a silicon substrate in a thickness of 10 mu m on a dry basis and thermally cured, gives a polyimide film having a residual stress of 33 MPa or lower; and a polyamic acid ester composition comprising different polyamic acid esters which as a whole have the repeating units comprising a tetravalent benzene group and the repeating units comprising a tetravalent diphenyl ether group in a specific ratio.
