| 摘要 |
<p>A CSP for electrically connecting a bump electrode (2) area-arranged on a chip (1A) to a bonding pad (BP) through Cu interconnection (6), wherein the surface of the Cu interconnection (6) is covered with a barrier layer (14) to prevent Cu atoms from diffusing from the Cu interconnection (6) into a polyimide resin layer (3) because of a heating step during the manufacturing process.</p> |
