| 摘要 |
PURPOSE: Provide is a norbornene polymer composition excellent in electrical properties such as dielectric constant and dielectric loss tangent and also in adhesion property to metals. Various kinds of moldings, sheets, films, prepregs, and laminates suitable for use as circuit boards and the like are provided using the norbornene polymer composition having such excellent properties. CONSTITUTION: Provided is a norbornene resin composition comprising 100 parts by weight of a thermoplastic norbornene polymer and 1 to 150 parts by weight of a thermosetting resin. Also (1) a molding formed from such a composition; (2) a prepreg with a reinforcing base material impregnated with the composition; (3) a laminate obtained by laminating sheet-like moldings and/or prepregs obtained with the composition on one another and crosslinking them; (4) a laminate with a film formed of the composition laminated on a metal layer, and the like are provided.
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