METHOD FOR INTERCONNECTION HAVING INCREASED ELECTROMIGRATION LIFETIME

摘要

PURPOSE: A method for an interconnection having increased electromigration time is provided to reduce the mass transfer due to the electromigration so as to reduce the electromigration lifetime. CONSTITUTION: A method for an interconnection having increased electromigration lifetime includes following steps. At the first step, a liner(40) is vaporized on a metal plasma display panel by using ionized metal plasma physical vaporization method. At the second step, a metal interconnection member(26) is vaporized on the liner. At the third step, the angle distribution of the grain of the metal interconnection member is reduced by the liner, which results in the prolonged electromigration lifetime. The liner according to the one embodiment of the present invention is made of the material having high electromigration resistance.