| 摘要 |
A circuit board comprising a board body which includes an insulating substrate or a plurality of laminated insulating substrates. The circuit board includes a connection material for electrically connecting together circuit patterns that are formed on both surfaces of the board body and/or a connection material for electrically connecting together a circuit pattern formed on one surface of the board body and circuit patterns formed between the insulating substrates. The connection material is constituted by an electrically conducting substance filled in a through-hole formed in the board body, and at least one end surface of the electrically conducting substance is substantially flush with the circuit pattern formed on one surface of the board body. An electrically conducting pattern having a substantially uniform thickness is formed to cover a connection region between the one end surface of the electrically conducting substance and one of the circuit patterns, the electrically conducting pattern being composed of a cured product of a curable electrically conducting substance. |
