APPARATUS FOR REMOVING SLURRY OF CMP(CHEMICAL MECHANICAL POLISHING) PAD

摘要

PURPOSE: An apparatus for removing slurry of a CMP(chemical mechanical polishing) pad is provided which can prolong the lifetime of the CMP pad, by suppressing the wearing of the polishing pad, and can form pore of the polishing pad more deeply and can make the surface rough again. CONSTITUTION: A disc(10) is arranged which is rotated on a surface of a polishing pad which polishes a wafer with a slurry. A scratching member, which is formed with a brushes(11) of long plate shape and pins(12) removing slurry gathered on a number of pores formed on the surface of the polishing pad, is attached on the bottom of the disc. The width of the scratching member is narrow than the width of the pore as the scratching member is inserted to the pore.