发明名称 |
METHOD OF FORMING CONTACT PLUG IN SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A method of forming a contact plug is to prevent an etching residue and impurities form being generated, thereby subsequent cleaning process being dispensed with, and to have no curved portion or step at a boundary of a contact plug and an insulation film. CONSTITUTION: A method of forming a contact plug comprises the steps of: forming an oxide film(8) on a first conductive layer and etching the oxide film to form the contact hole; forming a polysilicon film(9) on the resultant product thus obtained; and wet-etching the polysilicon film in aqueous ammonia solution until the surface of the oxide film being exposed. The aqueous ammonia solution is an aqueous solution in which ammonia solution having a composition of from 20 to 30 wt% and ultra-pure water are mixed at a ratio of from 1:5 to 1:10 by volume.
|
申请公布号 |
KR20000041400(A) |
申请公布日期 |
2000.07.15 |
申请号 |
KR19980057259 |
申请日期 |
1998.12.22 |
申请人 |
HYUNDAI ELECTRONICS IND. CO., LTD. |
发明人 |
PARK, CHANG SEO;CHOI, HYEONG BOK |
分类号 |
H01L21/28;(IPC1-7):H01L21/28 |
主分类号 |
H01L21/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|