发明名称 METHOD OF FORMING CONTACT PLUG IN SEMICONDUCTOR DEVICE
摘要 PURPOSE: A method of forming a contact plug is to prevent an etching residue and impurities form being generated, thereby subsequent cleaning process being dispensed with, and to have no curved portion or step at a boundary of a contact plug and an insulation film. CONSTITUTION: A method of forming a contact plug comprises the steps of: forming an oxide film(8) on a first conductive layer and etching the oxide film to form the contact hole; forming a polysilicon film(9) on the resultant product thus obtained; and wet-etching the polysilicon film in aqueous ammonia solution until the surface of the oxide film being exposed. The aqueous ammonia solution is an aqueous solution in which ammonia solution having a composition of from 20 to 30 wt% and ultra-pure water are mixed at a ratio of from 1:5 to 1:10 by volume.
申请公布号 KR20000041400(A) 申请公布日期 2000.07.15
申请号 KR19980057259 申请日期 1998.12.22
申请人 HYUNDAI ELECTRONICS IND. CO., LTD. 发明人 PARK, CHANG SEO;CHOI, HYEONG BOK
分类号 H01L21/28;(IPC1-7):H01L21/28 主分类号 H01L21/28
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