SEMICONDUCTOR CHIP SIZE BALL GRID ARRAY PACKAGE

摘要

PURPOSE: A semiconductor chip size ball grid array package is provided to make it compact by excluding prior electrical connection due to metal wires and enhance the reliability through sufficient heat radiation in operating a chip by exposing a top surface of the chip. CONSTITUTION: A chip(11) is attached on a rectangular base tape(12), within which circuit lines(13) are installed. Leads(14) are projected from the sides of the base tape(12) to be connected to the circuit lines(13) and chip pads(11a) of the chip(11). A box type fence(15) of constant thickness and height is installed outside the base tape(12) and chip(11). The internal space of the fence(15) is filled with filling agent(16) of high strength for the protection of the leads(14). A plurality of solder balls(17) are attached to a bottom surface of the base tape(12) to be connected to one end of the circuit lines(14).