| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for forming an insulating film on a flip chip or CSP(chip scale package) which is done easily at low cost with reliability, and to provide a method for mounting a flip chip or CSP where the insulating film is formed on a printed board. SOLUTION: A process, where a bump 3 is formed on the surface of a wafer 1 where a circuit is formed, a process in which a support film 5 with a resin layer comprising a photosetting resin and thermosetting resin is bonded by thermocompression to a wafer surface where the bump 3 is formed in that process so that the resin layer contacts the wafer surface, so that a setting resin layer 4 is formed in the gap between the support film and the wafer surface, a process where the resin layer 4 formed in that process is irradiated with active light ray so that the resin layer is photoset, and a process where the support film 5 is peeled so that a metal surface at the bump head part is exposed, are provided. After that, the wafer 1 is into chips and the cut chip is bonded by thermocompression to a printed board 7 to form an insulating layer 4c.</p> |
