| 摘要 |
PROBLEM TO BE SOLVED: To improve flame resistance, wet-resistance reliability, and fluidity of a semiconductor sealing resin composition, by making it contain an epoxy resin, a phenol resin, a polyhedron- form composite metal hydroxide represented by a specific formula, and a red-phosphorous based flame-resistant agent. SOLUTION: As epoxy resin (A component), various kinds of epoxy resins, e.g. a biphenyl- type epoxy resin are preferable. A phenol resin (B component), used together with the A component is used as the hardening agent of the epoxy resin, and a phenol aralkyl resin is preferable. With respect to a composite metal hydroxide, a polyhedron-form composite metal hydroxide (C component) represented by a general formula of m(MaOb).n(QdOe).cH2 O[where M, Q different metal elements from each other is used, and Q is a metal element selected from among IVa-VIIIa, Ib, IIb of the periodic table, and further, m, n, a to e are integers]. As the metal element M, Al, Mg, Ca, Ni, Co, Sn, Zn, etc., are exemplified, and as the other metal; element Q, e.g. Fe, Co, Ni, Pd, Cu, etc. Can be cited to be selected as their kind solely or as two or more kinds of them concurrently. As a red-phosphorous based flame-resistant agent (D component) used together with the A-C components, the red phosphorous having its surface coated with a shell portion is used. The foregoing respective components are forced to be contained in a semiconductor sealing resin-composition.
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