发明名称 SLUDGE-FREE TREATMENT OF COPPER CMP WASTES
摘要 Waste slurry containing dissolved metal from CMP (11), e.g., is subjected to sludge-free processing. Embodiments include separating the waste slurry with a solids filter (13) into a solid-free dissolved metal-containing liquid filtrate portion (18) and a concentrated solids-containing portion (16), removing the dissolved metal from the filtrate by means of an ion exchanger (20), back-washing the concentrated solids-containing portion with metal-free effluent (25) from the ion exchanger (20) to further reduce its dissolved metal content, discharging the washed concentrated solids-containing portion to a waste drain (23), removing the metal from the ion exchanger in solution form, and optionally extracting solid metal from the solution by electrowinning (32).
申请公布号 WO0040512(A1) 申请公布日期 2000.07.13
申请号 WO1999US18184 申请日期 1999.08.10
申请人 ADVANCED MICRO DEVICES, INC. 发明人 DUNGAN, LAWRENCE, JAMES;HAN, LEON
分类号 B24B57/02;B01J49/00;C02F1/42;C02F1/461;C02F1/467;C02F1/469;C02F11/00;C02F11/12;C25C1/12;(IPC1-7):C02F1/42 主分类号 B24B57/02
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