发明名称 |
SLUDGE-FREE TREATMENT OF COPPER CMP WASTES |
摘要 |
Waste slurry containing dissolved metal from CMP (11), e.g., is subjected to sludge-free processing. Embodiments include separating the waste slurry with a solids filter (13) into a solid-free dissolved metal-containing liquid filtrate portion (18) and a concentrated solids-containing portion (16), removing the dissolved metal from the filtrate by means of an ion exchanger (20), back-washing the concentrated solids-containing portion with metal-free effluent (25) from the ion exchanger (20) to further reduce its dissolved metal content, discharging the washed concentrated solids-containing portion to a waste drain (23), removing the metal from the ion exchanger in solution form, and optionally extracting solid metal from the solution by electrowinning (32).
|
申请公布号 |
WO0040512(A1) |
申请公布日期 |
2000.07.13 |
申请号 |
WO1999US18184 |
申请日期 |
1999.08.10 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
DUNGAN, LAWRENCE, JAMES;HAN, LEON |
分类号 |
B24B57/02;B01J49/00;C02F1/42;C02F1/461;C02F1/467;C02F1/469;C02F11/00;C02F11/12;C25C1/12;(IPC1-7):C02F1/42 |
主分类号 |
B24B57/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|