发明名称 MANUFACTURE OF PACKAGE FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To improve reliability of a sealing, when heating locally by a high-frequency power the blazing portion of a metallic cover to a ceramic package, by passing a gas along the central portion of the metal cover, and by lowering relatively the temperature of its central portion than that of its peripheral portion which contributes to airtight joining to the ceramic package. SOLUTION: In an annular high-frequency coil 5 provided in a high-frequency heating apparatus, there is formed a receiving platform 7 made of mica, etc., which serves as one portion of an suction apparatus by using its hollow inside as an sucking tube 71. The receiving platform 7 is formed of a material unheated by high-frequency heating to make avoidable the waste of an excess energy. A metal cover 2 is mounted on the top surface of the receiving platform 7, and further a ceramic package 1 is mounted on the metallic cover 2 so that an electronic element 3 is stored in it airtightly. Then, while sucking the metallic cover 2 in the direction shown by an arrow by the sucking tube 71 of the receiving platform 7, the high-frequency coil 5 is subjected to current application for brazing the cover 2 to the package 1 by the high-frequency heating. At this time, since the metal cover 2 is sucked by the suction tube 71, its central portion is cooled to suppress the vaporization of a brazing material.
申请公布号 JP2000195978(A) 申请公布日期 2000.07.14
申请号 JP19980370364 申请日期 1998.12.25
申请人 DAISHINKU CORP 发明人 NAKADA HOZUMI;NAKAJIMA MIKIO;IIZUKA MINORU
分类号 H01L23/02;(IPC1-7):H01L23/02 主分类号 H01L23/02
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