Semiconductor device and fabrication method thereof

摘要

A semiconductor device is provided which improves reliability by preventing connection defects with extensions and interface peeling occurring between a substrate and a sealing resin, and which can reduce the production cost by simplifying the fabrication process. In this semiconductor device, each lead (16) for electrically connecting an electrode terminal (12) of a semiconductor chip (10) to an external connection terminal (14) comprises an extension (17) extending parallel to an electrode terminal formation surface of the semiconductor chip (10) with a predetermined distance from the electrode terminal formation surface. An external connection terminal post (22) is provided at one of the end portions of the extension (17), and an electrode terminal post (24) is connected to the electrode terminal (12) of the semiconductor chip (10). The electrode terminal post (22) and the extension (17) are sealed by a sealing resin (18), and the distal end portion of the external connection terminal post (24) is exposed from the sealing resin (18).