| 摘要 |
A wafer scrubbing device for cleaning the surfaces of a thin disk disposed on a stationary spin chuck employs a double brush arrangement whereby brush rotation induces rotation of the disk to be cleaned and whereby the speed differential between the constant rotational speed of the brushes and the [variable] rotational speed of the disk due to the relative position of the brushes on the disk causes the scrubbing of both surfaces and the edge of the disk. |
