发明名称 PLATING DEVICE AND PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a plating device for plating in stripe on the both sides of a band materia. SOLUTION: An inlet 51 for a band 40 is formed at one end of an electroplating bath 50 and an outlet for the band 40 at the other end, endless masking belts 70Ua, 70Ub, 70La and 71Lb are respectively laid over the rollers 61a, 61b, 62a and 62b provided respectively on the inlet 51 side and outlet 52 side to provide masking belt rotors 60Ua, 60Ub, 60La, and 60Lb. The masking belt rotors are opposed to one another to put the band 40 sent to the outlet 52 from the inlet 51 between them and provided in two upper and lower stages in correspondence with the respective non-plating regions of the band 40, and the peripheries of the masking belts are successively held firmly to the non- plating regions or both sides of the band 40 as the strip is made to mask the regions.
申请公布号 JP2000192280(A) 申请公布日期 2000.07.11
申请号 JP19980364438 申请日期 1998.12.22
申请人 SUMITOMO WIRING SYST LTD 发明人 NAKAMURA ATSUSHI
分类号 C25D5/02;(IPC1-7):C25D5/02 主分类号 C25D5/02
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