HEAT SINK STRIP FOR TRANSFER MOLDING AND MANUFACTURING METHOD OF BGA PACKAGE USING THE SAME

摘要

PURPOSE: A heat sink strip and a ball grid array(BGA) package using the heat sink strip are provided to enable a transfer molding process. CONSTITUTION: A heat sink strip(100) includes a plurality of heat sinks(1) each located in a central part of each strip unit, and a supporter(3) mechanically connected with the heat sinks(1) by tie bars(2). A slot(4) having a fixed length(L) is formed in one side of each heat sink(1). In addition, several cuts(5) are formed in the supporter(3), each cut(5) having a fixed width(W) and corresponding to each slot(4). A circuit board having a central opening therein is attached on each heat sink(1), and a semiconductor chip is then attached on the heat sink through the window. The circuit board and the chip are electrically connected by wires, and then subjected to a transfer molding process. In the transfer molding process, melted molding compound is injected into a molding apparatus through the slot(4) and the cut(5) to encapsulate the chip and the wire.