发明名称 RADIATION SENSITIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a radiation sensitive composition superior in sensitivity, resolution, focal depth, pattern profile, and PED resistance. SOLUTION: The radiation sensitive composition comprises resins (a), (b), and a photoacid generator (c) and at least part of alkali-soluble phenolic hydroxyl groups of the resin (a) is protected with an acid-decomposable protective group represented by general formula (1), and at least a part of alkali-soluble phenolic hydroxyl groups of the resin (b) is protected with an acid-decomposable protective group represented by general formula (2), and the following inequality is satisfied, Mwa<=Mwb, where each of Mwa and Mwb is a weight average molecular weight of the resin (a) and the resin (b), respectively. In formula (1) and (2), each of R1 and R2 is an H atom or an optionally substituted alkyl group and each may combine with each other to form a ring; R3 is a 1-12C optionally substituted alkyl group and R2 and R3 may combine with each other to form a ring; and R4 is a 1-3C alkyl or such alkoxy group.
申请公布号 JP2000187328(A) 申请公布日期 2000.07.04
申请号 JP19980364502 申请日期 1998.12.22
申请人 MITSUBISHI CHEMICALS CORP 发明人 FUJITA ATSUSHI
分类号 H01L21/027;C08K5/41;C08L25/18;C08L61/04;G03F7/039 主分类号 H01L21/027
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