发明名称 |
Universal alignment marks for semiconductor defect capture and analysis |
摘要 |
A method of using universal alignment marks on a semiconductor wafer that allows the accurate alignment of scanning and analysis tools in relation to the semiconductor wafer. The information in the universal alignment marks are utilized by a vendor generated algorithm incorporated into the respective scanning or analysis tools to accurately position the tool in relation to the semiconductor wafer.
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申请公布号 |
US6084679(A) |
申请公布日期 |
2000.07.04 |
申请号 |
US19990285430 |
申请日期 |
1999.04.02 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
STEFFAN, PAUL J.;YU, ALLEN S. |
分类号 |
G03F7/20;G03F9/00;H01L23/544;(IPC1-7):G01B11/00 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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地址 |
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