发明名称 Solder bonding/debonding nozzle insert
摘要 In an apparatus for soldering/desoldering components having a nozzle with larger and smaller ends, the larger end for attaching to an exhaust for drawing a vacuum and to a supply of heated gas for at least softening solder, an insert is attached at the smaller end of the nozzle to adjust the size of that opening for receiving each of a plurality of components, fitting different inserts to different sizes of components.
申请公布号 US6082608(A) 申请公布日期 2000.07.04
申请号 US19980110916 申请日期 1998.07.06
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GABRIEL, CHARLES FELIX;JIMAREZ, MIGUEL ANGEL;ZDIMAL, JOSEPH EDWARD
分类号 B23K1/012;B23K1/018;H05K13/04;(IPC1-7):B23K1/00;B23K5/00;B23K31/02 主分类号 B23K1/012
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