发明名称 |
Solder bonding/debonding nozzle insert |
摘要 |
In an apparatus for soldering/desoldering components having a nozzle with larger and smaller ends, the larger end for attaching to an exhaust for drawing a vacuum and to a supply of heated gas for at least softening solder, an insert is attached at the smaller end of the nozzle to adjust the size of that opening for receiving each of a plurality of components, fitting different inserts to different sizes of components.
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申请公布号 |
US6082608(A) |
申请公布日期 |
2000.07.04 |
申请号 |
US19980110916 |
申请日期 |
1998.07.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GABRIEL, CHARLES FELIX;JIMAREZ, MIGUEL ANGEL;ZDIMAL, JOSEPH EDWARD |
分类号 |
B23K1/012;B23K1/018;H05K13/04;(IPC1-7):B23K1/00;B23K5/00;B23K31/02 |
主分类号 |
B23K1/012 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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