发明名称 WIRING SUBSTRATE AND ITS MANUFACTURE
摘要 <p>PROBLEM TO BE SOLVED: To decrease a loop area formed of high frequency power supply current without mounting a part such as a capacitor for restraining radiation noise. SOLUTION: A multilayer substrate 1 is provided with a via 8 and a decoupling capacitor is practically formed of an extension part 7a of a power supply wiring 7 formed in an inner wall of the via 8 and a conductor 11 plugging a central hole 9 of the via 8 and is connected to a ground wiring 5. As a result, it is possible to decrease an area of a current loop and to restrain radiation noise effectively.</p>
申请公布号 JP2000188448(A) 申请公布日期 2000.07.04
申请号 JP19980364840 申请日期 1998.12.22
申请人 SONY CORP 发明人 ARAKI KENJI
分类号 H05K1/02;H05K1/16;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K1/02
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