| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical module with enhanced flexibility in the configuration of an electronic circuit. SOLUTION: In an optical module, a substrate 20 is mounted on an electronic circuit mounting portion 6 provided at a lead frame 2, and a wiring pattern including the portion of cross wiring is formed on the substrate 20 to configure an electronic circuit. This enables flexibility in the construction of the electronic circuit to be enhanced. Furthermore, when a resinous through portion 18a is constructed of a substrate through-hole 20a formed in the substrate 20 and a frame through-hole 6a formed in the electronic circuit mounting portion 6 so as to form an electronic circuit sealing portion by sealing the electronic circuit portion with a resin, the resin at the upper and lower portions of the substrate 20 can be integrated through the resinous through portion 18a to prevent the occurrence of strains and cracks in the resin. |
