| 摘要 |
PURPOSE:To provide a multilayered board which is composed substantially of copper foil and a polyimide resin layer and has an excellent chemical resistance, curling resistance, and adhesive property and its manufacturing method and, in addition, to improve the connection reliability and mounting density of the board by making the board easily connectible. CONSTITUTION:After copper circuits 1' and a thermoplastic polyimide resin layer 3 are respectively formed on both surfaces of a low-linear expansion polyimide resin layer 2, a multilayered structure is constructed by utilizing the sticking function of the layer 3. When a through hole is formed through the layers 2 and 3 and continuity is obtained through the hole, the electrical connection reliability of this multilayered board is improved. In addition, when the layers 2 and 3 are formed by respectively applying the precursors of the low-linear expansion plastic resin and thermoplastic polyimide resin, the adhesive properties of the layers 2 and 3 can be improved. |
