发明名称 Free flow abrasive hole polishing
摘要 <p>A free flow abrasive hole polishing system and method improves air flow and resultant component cooling efficiency for an apertured article (18). The free flow abrasive hole polishing system mixes an abrasive particle component (12) with a carrier media (14) to create a free flowing abrasive particle carrier media mixture. This mixture is pumped through apertures (20) defined by aperture walls (22) in the article (18) to improve air flow and resultant cooling efficiency of the article. Since the abrasive particles (12) have mass and velocity and the free flowing media (14) does not have resistance to flow, the abrasive particles (12) impinge on peaks of the aperture walls (22), predominantly removing high spots in the aperture walls (22). &lt;IMAGE&gt;</p>
申请公布号 EP1013378(A2) 申请公布日期 2000.06.28
申请号 EP19990310367 申请日期 1999.12.21
申请人 GENERAL ELECTRIC COMPANY 发明人 SHAW, JAMES STEPHEN
分类号 B24B31/116;(IPC1-7):B24B31/116 主分类号 B24B31/116
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