发明名称 RESIN MOLDING MOLD
摘要 PROBLEM TO BE SOLVED: To produce in a short time and to improve abrasion resistance by forming the second layer which supports the first layer of a mold surface layer formed from a thermosetting resin containing fine silicon carbide particles from a thermosetting resin containing metal particles. SOLUTION: In the first layer 5 of the mold surface of a resin molding mold, recessed parts 8a and so forth, and projected parts 8b and so forth for crimping are formed on a molding surface 8 opposite to a cavity by a thermosetting resin (epoxy resin) 7 containing a prescribed weight percentage of fine silicon carbide particles 6 and so forth, the silicon carbide 6 and so forth is glued by the epoxy resin, the strength of the first layer is secured, and fluidity before curing is kept good. The second layer 10 which supports the first layer 5 is made porous by applying a thermosetting resin (epoxy resin) 14 on the surfaces of metal particles (steel balls) 12 to bond the balls 12 and so forth together to enable evacuation from the vacuum holes 20 and so forth of the first layer 5 and to improve the strength of the second layer 10. In this way, plating is made unnecessary, the resin molding mold can be produced in a short time, and abrasion resistance is improved.
申请公布号 JP2000176942(A) 申请公布日期 2000.06.27
申请号 JP19980355167 申请日期 1998.12.14
申请人 HONDA MOTOR CO LTD 发明人 FURUYA TAMIO;WAKABAYASHI ITSUKI;NAKAJO KENICHI;YAMADA SATOSHI;HASHIMOTO HIROE
分类号 B29C33/38;B29C51/30;B29L31/30;(IPC1-7):B29C33/38 主分类号 B29C33/38
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