| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device by which a plating film is formed on a body to be treated in uniform thickness, a plating system and a plating method using the system. SOLUTION: This plating device 4 is provided with a plating tank 15 to be filled with a plating soln., a first O ring 17 furnished on the top of the plating tank 15 and connected to a substrate electrode 18 formed on the surface of a wafer 2, a second O ring 20 provided on the top of the plating tank 15 so that the plating soln. in the tank 15 does not come in contact with the first O ring 17, an anode plate 24 set in the tank 15 and an ultrasonic vibrator 26 furnished in the tank 15. The first O ring 17 and second O ring 20 are annular, and the first O ring 17 is made of a conductive rubber and the second O ring 20 of a chemical-resistant rubber.
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