| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate plating device by which the plating thickness on a semiconductor wafer is made uniform over the whole surface and to furnish its usage. SOLUTION: The plating thickness on a semiconductor substrate W close to plural cathodes K1 to K3 is detected by plating thickness sensors C1 to C3 and the detected value is inputted to a control means 30. The potential difference between the cathode on the thin-plating side on the substrate W and an anode A is made larger than before, and the potential difference between the cathode on the thick-plating side on the substrate W and the anode A is made smaller than before by controlling the feed voltage to the respective cathodes K1 to K3 by the control means 30 and 35 based on the inputted detected plating thickness. Consequently, the plating thickness on the substrate W is made uniform over the whole surface.
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