| 摘要 |
PROBLEM TO BE SOLVED: To reduce and almost eliminate the phenomenon that the center part of a mask board peels and floats from the 1 coats surface of a semiconductor wafer by forming the mounting face of a semiconductor wafer into the shape in which the center part is higher than the ambient part and clamping all the periphery or plural places around the outside more than the semiconductor wafer in the mask board laminated on the surface of the semiconductor wafer to a supporting board. SOLUTION: By providing the center part on the upper face of a supporting board 1 with a projection part 4, the shape in which the center part is higher than the circumference is composed. The upper face of the supporting board 1 is mounted with a semiconductor wafer A, the upper face is laminated with a mask board 2, and, after that, plural places in the circumference of the mask board 2 are clamped by clamping means 3 such as bolts or the like. The mask board 2 warps and deforms to a projecting shape upwardly, and also, the semiconductor wafer A warps and deforms into a projecting shape upwardly. The mask board 2 and the semiconductor wafer A warp and deform into projecting shapes upwardly in a state in which they are tightly adhered. The precision of the dimensions and shape of each electrode is remarkably improved, and the number of defective chips is securely reduced.
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