RESIN SEALED SEMICONDUCTOR DEVICE

摘要

PURPOSE: A resin sealed semiconductor device is provided to prevent a malfunction of a semiconductor integrated circuit by a visible ray. CONSTITUTION: A resin sealed semiconductor device relates to a resin sealed semiconductor device for connecting an LSI chip on a wiring substrate. The resin sealed semiconductor device comprises an organic resin wiring substrate(4), an LSI(Large Scale Integrated circuit) chip(1), and a resin. The LSI chip is composed of a semiconductor integrated circuit. The LSI chip comprises a bare chip installed on the organic resin wiring substrate by a plurality of electric bonding body. The resin is inserted into a gap between the organic resin wiring substrate and the LSI chip.