发明名称 |
WAFER CHUCK |
摘要 |
PURPOSE: A wafer chuck is provided to improve a nose for better absorption of the wafer chuck. CONSTITUTION: A wafer chuck includes a nose, and a rubber pad(34). The wafer chuck absorbs the wafer to fix the wafer or transfer the wafer. The nose for absorption of the wafers is in a planar shape. The rubber pad(34) with an O-ring shape is attached to the nose for wafer absorption to seal the region between the nose and the wafer absorbed by the nose. The rubber pad(34) touches the wafer in an area, not in a line for better absorption. The nose is further of a plastic material. The plastic material is further of a teflon material.
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申请公布号 |
KR20000034535(A) |
申请公布日期 |
2000.06.26 |
申请号 |
KR19980051874 |
申请日期 |
1998.11.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG, JIN YOUNG;BAE, SEONG DONG |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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