| 摘要 |
PROBLEM TO BE SOLVED: To dissipate effectively heat from a microcomputer which is subjected to surface mounting on a printed board inside a case of a bag structure, constituting an electronic control unit(ECU) to the outside of a case. SOLUTION: A heat-absorbing part 40 is formed in an inner wall surface 11c of a case 11 facing opposite and proximate to an electronic component (microcomputer) 17b with heat-generating property, which is subjected to surface mounting on a printed board 16 of an electronic control circuit 15 stored inside the case 11 of a bag structure of an ECU. Heat from the electronic component 17b with heat generating property can be cooled effectively through the heat- absorbing part 40. Reliability of an ECU can be improved by fixing the tip side of the printed board 16 by a projection part 50 and properly holding positioning relation between the heat absorbing part 40 and a surface of the electronic component 17b with heat generation property.
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