| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of a pluck of a resin, and burrs of a bump and to enable a stable continuous working by a method wherein a cutting blade is rotated so as to pass through the center of rotation of a chuck table, and the resin is machined off until the bump is exposed. SOLUTION: A semiconductor wafer 10 is mounted on a chuck table 37 facing its surface coated with a resin to the outside, the wafer 10 is located at a position facing to a wheel for cutting and with the table 37 rotated, a grinding means 35 is lowered while a spindle 38 is being rotated. The wheel is rotated in keeping with the rotation of the spindle 38, the point of a cutting blade, which is ratated in keeping with the rotation of the wheel, comes into contact with the resin covering the surface of the wafer 10 and a notch is given to the surface of the resin. Moreover, by lowering the cutting means 35 gradually with the rotation of the wheel, the resin is gradually taken off and a bump is soon exposed. |
