发明名称 |
Temperature control carrier head for chemical mechanical polishing process |
摘要 |
The temperature of a wafer is controlled during a chemical mechanical polishing process. Fluid containment is provided on a wafer backing plate in contact with the wafer during the chemical mechanical polishing process. Transportation of fluid is provided to and from the fluid containment during the chemical mechanical polishing process. Temperature of the fluid is controlled in order to control temperature on the wafer during the chemical mechanical polishing process.
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申请公布号 |
US6077151(A) |
申请公布日期 |
2000.06.20 |
申请号 |
US19990313233 |
申请日期 |
1999.05.17 |
申请人 |
VLSI TECHNOLOGY, INC. |
发明人 |
BLACK, ANDREW J.;VINES, LANDON |
分类号 |
B24B41/06;B24B49/04;B24B49/14;(IPC1-7):B24B49/00 |
主分类号 |
B24B41/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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