发明名称 Clover-leaf solder mask opening
摘要 A solder mask having a clover-leaf shaped opening around a PTH for enhanced performance. The solder mask resides on a surface of a printed circuit board comprising lands and PTH's. The opening around the PTH is configured to maintain a minimum channel width between the PTH and an adjacent land while maximizing the opening around the PTH, thereby decreasing the likelihood that the solder mask material will be inadvertently drawn into the PTH.
申请公布号 US6078013(A) 申请公布日期 2000.06.20
申请号 US19980168584 申请日期 1998.10.08
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 STACK, JAMES RICHARD
分类号 H05K1/11;H05K3/34;H05K3/42;(IPC1-7):H05K1/00 主分类号 H05K1/11
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