| 摘要 |
PROBLEM TO BE SOLVED: To mixedly mount insert mount components and surface mount components on a board at a high reliability by mounting lead insert type electronic components subjected to a solder bond pre-treatment step and reflowing solder to solder them to the board. SOLUTION: Surface mount component solder lands are printed with solder paste on a surface B 22 of a board 18, the board 18 is reversed, a thermosetting adhesive is coated near openings of through-holes 44 for inserting straight insert components on a surface A 20, thereby forming an adhesive layer, straight insert components 28 and other insert components than the components 28 are inserted in the through-holes 44 of the board 18 from the surface 20, the tips are clinched, the board 18 is reversed with the surface B 22 up, surface mount components, i.e., chip components and package components are mounted, the board 18 is sent to a reflow apparatus with the surface B 22 up, and solder is molten and cooled to form solder zones, thus securing all the components to the board 18.
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