| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board, an electronic component and a their connecting method whereby, in the flip chip mounting of the electronic component on a wiring board, the mounting accuracy, the reliability and the connection strength can be improved without being influenced by the alignment accuracy of a mounting machine. SOLUTION: A wiring board 23 has a mount of an electronic component 21 on an insulation board 24, the electronic component 21 has many bump electrodes 22 on the lower side, the mount has many electrode pads 25 corresponding to the bump electrodes 22, the electrode pads 25 are composed of metallic flat parts 26 on the surface of the insulation board 24 and solder recessed parts 27 having recesses formed into the flat parts 26, and the surface electrode pads are similarly composed of metallic flat parts and solder recessed parts having recesses formed into the flat parts, thus forming the electronic component. The mounting accuracy, the reliability and the connection strength of the bump electrodes to the electrode pads in the flip chip mounting can be improved without being influenced by the alignment accuracy of a mounting machine.</p> |
